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Product Information
New Products

New High Speed Dual Stack Edge Card System 07/10
Samtec has recently introduced a new high speed edge card socket that accepts two PCB cards.  The connector accommodates two .062” (1.6mm) thick PCB cards. Read more . .

AccliMate™ Sealed Rectangular Ethernet System Saves Space & Meets IP68 Specs 06/10
Samtec has recently expanded its line of IP68-rated sealed interconnect systems with the new AccliMate™ Sealed Rectangular Ethernet Cable Plug & Receptacle.  Read more . .

Edge Rate Cables for High Speed, Rugged & Test Applications 03/10
Samtec’s High Speed Edge Rate™ Twinax, Micro Coax, and Direct-to-Lead Coax Cable Assemblies incorporate its rugged .8mm (.0315”) pitch Edge Rate™ terminals and sockets... Read more . .

HSEC8  Edge Rate Card Sockets Optimized for High Speed Micro Backplane Applications 02/10
Samtec’s Edge Card Sockets with signal integrity optimized Edge Rate™ contacts are ideal for many high speed micro board-to-board and micro backplane applications Read more . .

UPSUPT  PowerStrip™/15 Interconnects Offer High Power in a Small Package  02/10 
Samtec’s newest line of power interconnect solutions is the PowerStrip™ /15 family featuring an ultra small, space saving design and dual leaf blade contacts capable of carrying from 14A to 23A per contact 


Read more . .

flexdata links

Introducing Sudden Circuits® Flex Data Links

11/09

Samtec Sudden Circuits® are quick-turn, highly configurable, high speed flex circuit data links....


  Samtec Expands HIgh Speed Edge Rate Interface Family 09/09

Samtec has expanded its popular line of .8mm (.0315") pitch Edge Rate contact interfaces (ERM8/ERF8) for board stacking applications with a new line...


PTFE Cable PTFE Cable Options for Samtec Discrete Wiere interconnect Options 08/09

Samtec has recently added polytetrafluoroethylene (PTFE) cable options for several of its discrete wire interconnect systems. This material’s ability to...


SEAF-RA

New Right Angle SEARAY™ High Density Interconnects from Samtec

08/09
Samtec has expanded its SEARAY™ High Density Open Pin Field Interconnect family with a new line of Right Angle Sockets for perpendicular and high speed micro backplane applications. Read more . . . 

QEM8/QEF8

Samtec Introduces New High Speed Edge Rate™ Interfaces

08/09

Samtec has expanded its high speed interconnect and cable line featuring its rugged Edge Rate™ contact system to include a new .8mm (.0315”) pitch...

Read more . . .

Samtec Expands Rugged Edge Rate™ Interface Family

06/09

Samtec has expanded its Edge Rate™ product line with the addition of .8mm (.0315”) pitch right angle and edge mount connector strips for perpendicular and co-planar applications. 


Samtec Introduces Mini USB IP68-Rated Sealed Circular System

05/09

Samtec has recently expanded its line of IP68-rated AccliMate™ Sealed Circular Cable Plugs and Receptacles with the addition of a Mini USB B-Type Sealed Circular System. 


Samtec Introduces 75Ohm BNC System Optimized for 3G SDI

05/09

The emergence of the 3 Gbps 3G Serial Digital Interface (3G SDI) which enables uncompressed digital transfer of 1080p and digital cinema has once again brought interconnect Signal Integrity considerations to the forefront of high speed system design.


Samtec Announces High Speed Direct Termination Cable Assembly

05/09

Samtec has expanded its cable line with a new High Speed Cable Assembly featuring its rugged Q2™ connector system and a patent-pending cable termination designed to maximize Signal Integrity.


Space-Saving High Speed Interconnect System from Samtec

04/09

Samtec has recently expanded its high speed, micro rugged interconnect offering with the addition of a self-mating, high speed connector system that maximizes PCB real estate with its super-slim body design.


Samtec Introduces Razor Beam™ Space-Saving Interconnect Systems

03/09

Samtec’s high speed Razor Beam™ interconnect systems are designed to maximize PCB real estate with their slim, ultra-fine pitch, low profile designs.


Mating Orientation Flexibility with Samtec’s New Hinged PowerStrip™

03/09

Samtec has expanded its rugged PowerStrip™ High Power Interconnect family with a hinged version of its 25 Amp PowerStrip™/25 system.  The FMPS/FMPT Series are ideal for applications that call for blind mating or where PCB real estate is tight.


Samtec Introduces Space-Saving Super Fine Pitch Interconnects
01/09

Samtec has recently introduced a new narrow body, super fine pitch, low profile board-level interconnect system ideal for applications where board real estate is at a premium.


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Disclaimer: The information in the New Products area may change without notice. All information posted here are "As Is" at time of release. Samtec, Inc. does not warrant that errors or changes will be corrected.
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